Rigetti Computing

Rigetti Computing

Hardware Design Engineer

May 2025 - Aug 2025Berkeley, California

Led quantum-hardware projects focusing on cryostat design and high-vacuum systems for quantum computing applications.

</Overview>

At Rigetti Computing, I worked as a Hardware Design Engineer on cutting-edge quantum computing hardware, specifically focusing on cryogenic systems and high-vacuum environments essential for quantum processor operation.

I led two quantum-hardware projects from concept to production, demonstrating rapid prototyping and engineering execution. One project progressed from blank CAD to pilot build in just 2 weeks, ultimately advancing to final production testing. This accelerated timeline was achieved through careful planning, efficient CAD workflows, and close collaboration with manufacturing partners.

A major accomplishment was authoring the master CAD and Bill of Materials (BOM) for a 350 mK Bluefors cryostat. This involved completing over 23 SolidWorks and Design for Manufacturing (DFM) iterations to optimize the design for both performance and manufacturability. I also produced more than 30 3D TPU AMS prints for prototyping and validation, allowing rapid physical testing of design iterations.

I gained extensive experience with Product Data Management (PDM) systems, releasing GD&T (Geometric Dimensioning and Tolerancing) drawings as revision-controlled PDFs to ensure proper version control and manufacturing clarity. Additionally, I engineered the high-vacuum fore-line with a bend radius constraint of less than 40mm, and created comprehensive BOM, step-by-step documentation, and drawings that reduced installation time by 25%.

</Key Achievements>

  • Led 2 quantum-hardware projects; drove one from blank CAD to pilot build in 2 weeks, advancing it to final production test
  • Authored the master CAD/BOM for a 350 mK Bluefors cryostat, completed 23+ SolidWorks/DFM iterations, 30+ 3D TPU AMS prints
  • Released GD&T drawings as revision-controlled PDFs through PDM
  • Engineered the high-vacuum fore-line (less than 40mm bend radius) and cut installation time by 25% using BOM, step-by-step documentation, and drawings

</Technologies & Skills>

SolidWorksCryogenic SystemsQuantum HardwareGD&TPDM3D PrintingVacuum SystemsDFM